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Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plants in Sherman, Texas

The landmark investment could reach $30 billion and create as many as 3,000 jobs over time

5 trends shaping the future of power management

Performance improvements in power density, electromagnetic interference, isolation, quiescent current, and noise and precision are giving designers the capabilities to push power further

Sensor fusion is enabling the next wave of autonomous robots

Sensors in robots that mimic human vision are accelerating automation, improving reliability and safety, and making our lives easier

Solving the top power design challenges at APEC 2022

TI addresses critical power-management design challenges for electric vehicles and industrial systems at APEC 2022

TI buffer amplifier increases signal bandwidth tenfold in data-acquisition systems

Test and measurement engineers can save months of design time by eliminating the need for custom ASICs and simplifying front-end designs

Latest company blog posts

5 trends shaping the future of power management

Sensor fusion is enabling the next wave of smart, autonomous robots

Building a fast, flexible EV charging network

Latest news releases

Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plants in Sherman, Texas

TI CEO Rich Templeton to speak at Bernstein investor conference