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TI selects Lehi, Utah, for its next 300-mm wafer fab

Construction will start later this year on a second 300-mm wafer fab in Lehi. This investment is part of our long-term manufacturing roadmap to support growth for decades to come.

Ultrasonic lens cleaning brings camera reliability into focus

As advancements in autonomy multiply the number of cameras and sensors on vehicles, drones, robots and more, a purely electrically driven method can help keep them all clean

High-voltage technologies are key to empowering a more sustainable future

As electrification becomes more common, semiconductor innovations enable us to interact with electric vehicles, renewable energy sources and other high-voltage systems safely and reliably

Haviv Ilan to become next president and CEO of TI

Haviv, a 24-year veteran of Texas Instruments, will become our next president and CEO, effective April 1. Haviv succeeds our current president and CEO, Rich Templeton, who will remain chairman of the board. 

5 reasons EVs are here to stay

Semiconductor technology is powering electric vehicles through the innovation curve, eliminating barriers to EV adoption and enabling automakers to design affordable cars that consumers love

Industry's first ultrasonic lens cleaning chipset enables self-cleaning cameras and sensors

Designers can create reliable, small and affordable cleaning systems for automotive and industrial applications using TI's ULC technology

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Latest company blog posts

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13 Feb 2023

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02 Feb 2023

Ultrasonic lens cleaning brings camera reliability into focus

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30 Jan 2023

High-voltage technologies are key to empowering a more sustainable future

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Latest news releases

07 Mar 2023 | Company news

Texas Instruments prices $1.4 billion of investment grade notes

02 Mar 2023 | Product & technology news

TI's GaN technology and real-time MCUs power LITEON Technology's new server power supply design

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