Jan 29, 2018

Developers can maximize efficiency in cost-sensitive power-control applications with new additions to TI's C2000™ Piccolo™ microcontroller portfolio

A highly integrated system-on-chip boosts performance in EV/HEV, grid infrastructure and industrial applications
Jan 24, 2018

High school student pilots aviation lesson, "STEM on the Fly," to inspire middle and high school students to love STEM

The fun, high-flying lesson explores the math and science needed for a career as Southwest Airlines pilot
Jan 09, 2018

TI revolutionizes automotive headlight systems with new high-resolution DLP® technology

Sophisticated new adaptive driving beam headlight technology enables automakers and Tier-1 suppliers to enhance driver visibility and communication
Dec 06, 2017

Industry's first zero-drift, nanopower amplifier combines ultra-high precision with the lowest power consumption

TI delivers the most precise nanopower op amp, reducing system power and maximizing battery life in precision IoT, industrial and personal electronics applications
Dec 05, 2017

TI broadens 4K UHD display possibilities with newly expanded portfolio of DLP® Products

New DLP 4K UHD chipsets enable stunning display products capable of delivering accurate, detailed images across a variety of applications
Nov 30, 2017

TI's new automotive LED lighting controller puts the power in designers' hands

Achieve higher power, better reliability and thermal dissipation in automotive LED lighting systems by selecting a controller and external MOSFET
Nov 29, 2017

Texas Instruments announces integration of its SimpleLink™ MCU platform with new Amazon FreeRTOS for quick cloud connectivity

TI and Amazon Web Services continue to enable end-to-end connections to the cloud for IoT-enabled devices
Nov 28, 2017

Merge the worlds of wired and wireless connectivity by connecting sensors to the cloud with new TI SimpleLink™ Ethernet MCUs

Simplify industrial gateway designs using new Ethernet MCUs with an integrated PHY leveraging 100 percent code compatibility across the SimpleLink MCU platform
Nov 16, 2017

TI DLP® technology enables next-generation augmented reality head-up displays

New automotive-qualified DLP3030-Q1 chipset and EVMs allow automakers and Tier-1 suppliers to create HUD systems with crisp, high-quality imagery

You must be logged in to view this item.

This area is reserved for members of the news media. If you qualify, please update your user profile and check the box marked "Check here to register as an accredited member of the news media". Please include any notes in the "Supporting information for media credentials" box. We will notify you of your status via e-mail in one business day.