News releases
Mar 09, 2020 | Product & technology news
Stackable DC/DC buck converter maximizes power density in high-current FPGA and processor power supplies
New SWIFT™ converter from TI delivers up to 160 A of output current, and bolsters thermal performance for communications, enterprise and industrial applications
Mar 03, 2020 | Company news
Texas Instruments prices $750 million of investment grade notes
Mar 02, 2020 | Product & technology news
Industry's first Grade 0 digital isolator enables reliable communication and protection in HEV/EV systems that exceed 125°C
Engineers can simplify high-temperature automotive designs while helping improve signal isolation and in-vehicle network performance with TI's new Grade 0 devices
Feb 20, 2020 | Company news
Kimberly-Clark CEO Michael Hsu to join TI board of directors
Feb 19, 2020 | Company news
TI Chief Financial Officer Rafael Lizardi to speak at Morgan Stanley investor conference
March 4, 2020, 11:15 a.m. Pacific time
Feb 19, 2020 | Product & technology news
Smallest 36-V, 4-A power module cuts solution size by 30%
TI offers high efficiency and low thermal resistance for industrial applications with a new power module in a QFN package
Feb 17, 2020 | Product & technology news
Industry's smallest linear thermistors help engineers reach new thermal limits
TI's new temperature sensors offer 50% higher accuracy, high sensitivity and single-point calibration
Feb 11, 2020 | Product & technology news
TI's EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging
Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply
Jan 30, 2020 | Company news
TI CEO Rich Templeton to speak at Goldman Sachs investor conference
February 12, 2020, 9:40 a.m. Pacific time
Jan 23, 2020 | Company news