Company blog

For Charles “Bob” Cook, a project assigned by Jack Kilby led to the development of the first integrated circuits to ever orbit the Earth – and a foundation for future space electronics.

Innovations in semiconductor packaging are helping meet demands for smaller, faster and more reliable chips that deliver high performance, improved power efficiency and lower costs.

Integrating powertrain systems into a compact mechanical enclosure can lead to more affordable, more efficient electric vehicles (EVs).

As consumers expect better performance out of their electronics, mitigating electromagnetic interference (EMI) becomes a bigger problem to solve.

TI's space-grade power-management devices are powering smarter, smaller satellites, enabling NASA engineers to better understand our universe.

Our new wireless BMS solution eliminates bulky wiring in electric vehicles, creating new opportunities to improve driving range and reliability.

Power electronics and teamwork are two of Pradeep Shenoy’s passions, and he’s at his best when they intersect. His love for technology began with a university project: Building a hybrid formula one race car. Now, he leads our company’s automotive power design team that is finding ways to push power further. 

From remote work to home-based education, wireless connectivity has become an integral part of our lives – and the pace of change will continue to accelerate. “Recent events have taken an enormous toll on people and economies around the world, but they also illustrate the importance of connectivity for how we live, learn and work,” said Mattias Lange, general manager for Embedded Connectivity Solutions. “This technology has allowed us to stay nimble and to adapt and succeed in a world that is ever-changing.”