TI’s latest 300-millimeter wafer fab in Lehi, Utah, begins production

LFAB is our second 300-mm fab to start production in 2022, about one year after our company purchased the facility

06 Dec 2022

Our company’s latest 300-millimeter wafer fab in Lehi, Utah, LFAB, has started production for analog and embedded products roughly one year after our company’s purchase of the facility

LFAB is our second 300-mm fab to start semiconductor production in 2022, providing manufacturing capacity our customers will need for decades to come. RFAB2 in Richardson, Texas, began initial production in September.

“This is an exciting time for the Lehi team as we expand our manufacturing operations to provide the capacity our customers will need for decades to come,” said Kyle Flessner, senior vice president, Technology and Manufacturing Group. “This achievement is part of our long-term capacity investments and further solidifies our commitment to expand internal manufacturing capacity to support the future growth of semiconductors in electronics." 

Building the next era of semiconductor manufacturing in Lehi, Utah

Located in the heart of Utah’s Silicon Slopes community, less than an hour from Salt Lake City, LFAB is the only 300-mm semiconductor wafer fab in Utah. 

The addition of LFAB to our manufacturing operations provides increased 300-mm capacity to support the continued growth of semiconductors in electronics. The fab has more than 275,000 square feet of clean room space, and the highly advanced facility includes seven miles of overhead delivery systems that quickly transport wafers through the fab. Our total investment in the Lehi fab will be about $3 billion to $4 billion over time, which will directly benefit the state and local economy. 

LFAB has the capability to support 65-nanometer and 45-nanometer technologies with the ability to go beyond those nodes as required, and has optimal process technology to produce complex devices like embedded processing chips. At full production, LFAB will manufacture tens of millions of chips daily that will go into electronics everywhere – from renewable energy sources to electric vehicles to space telescopes.

image of IFAB worker

“Production start in LFAB is an important milestone and I am proud of the progress the teams have made in a short time,” said Mohammad Yunus, senior vice president, Manufacturing Operations. “This is a testament to the strong collaboration and commitment from our Lehi and Dallas teams.”

Committed to manufacturing sustainably and supporting local communities

As part of our long history of investing in the communities where we live and work, we have also formed several partnerships in the local community with organizations such as United Way, Five.12 Foundation, Bridle Up Hope, Habitat for Humanity and others. In 2022 alone, the LFAB team supported our neighbors in Utah through more than 60 volunteering events, contributing more than 2,100 volunteer hours and investing nearly $600,000 in community organizations.

LFAB also supports our long-standing commitment to responsible, sustainable manufacturing through reductions in waste, water usage and energy consumption. Our water conservation and protection strategies include investing in reduction, recycling and reuse projects while restricting, reducing and monitoring chemicals that can affect water quality. 

“Our company has a long-standing commitment to being a good neighbor in our communities, and our LFAB employees are an integral part of the Lehi community,” said Trevor Bee, LFAB factory manager. “We’re also working diligently to drive semiconductor manufacturing excellence and to do business responsibly and sustainably. I am thrilled with the results so far and am excited about what’s to come.” 

Latest company blog posts
20 Mar 2024

Why 45- to 130-nanometer process nodes matter

13 Feb 2024

From helping refugees resettle into new homes to removing barriers to education for students, our employees are coming together to build stronger communities

06 Feb 2024

Learn about our collaboration with NASA and industry leaders in developing radiation-hardened, plastic packaging for space electronics, known as QML Class P, to power missions with size, weight and power in mind

View all blog posts